| PARAMETERS | STANDARD CAPABILITIES | SPECIAL REQUIREMENT |
|---|---|---|
| Max Layer Count - Rigid | 38 | Can go upto a max thickness of 5-5.5mm with ENIG finish. |
| Max Layer Count - Flex Rigid | 26 | Can go upto a max thickness of 5-5.5mm with ENIG finish. |
| Max Layer Count - Flex | 6 | 10 |
| Max Board thickness | 3.20mm | 3.20mm |
| Max circuit Size | 480 x 560 ( Multilayer ); 500 x 580 ( DSPTH ) |
550 X700mm (Multilayer) 570X 730mm (D/S) |
| Board Thickness Tolerance | + / - 10% | + / - 8% for thicker PCBs |
| Inner Layer Line width / Spacing | 4mil /4 mil ( 0.10mm / 0.10mm) in 18µ base copper | 3 mil /4 mil ( 0.076mm / 0.10mm) on 12µ base copper &3.5 mil/3.5 mil on 18 Base |
| Outer Layer Line width / Spacing | 4 mil / 4 mil ( 0.10mm / 0.10mm)in 18µ base copper | 3.5 mil /3.5 mil ( 0.09mm / 0.09mm)with 35µ Finish copper Without VF and Cap Plating |
| Minimum finished Hole diameter - PTH | 0.2 mm | 0.175mm |
| Aspect Ratio | 1:10 | 1:11 |
| Minimum Di-electric thickness | Laminate : 0.1mm Prepreg : 0.1mm |
Laminate : 0.05mm Prepreg : 0.065mm |
| Plating Thickness | Min PTH Copper plating thickness - 25µ | - |
| Non Conductive via filling | With Epoxy filling / Cap plating | - |
| Heat Sink PCB's Metal core |
Aluminum Core:0.8mm, 1.0mm & 1.6mm Thick) Copper Core: 0.1mm , 0.2mm,0.4mm and 0.8mm |
Metal Core - 6061 Aluminum Core (0.4mm) Thick |
| Surface Finish |
HASL ENIG (Electroless Nickel Immersion Gold) , (Ni - 3-6 µ, Au 0.08-0.1µ) Gold plating thickness (Edge connector - 0.8µ) Electrolytic Gold on Cu upto 3µ for RF PCBs |
Gold plating thickness (Edge connector -upto 1.5µ) |
| Impedance Tolerance | +/- 10% | - |
| Minimum soldermask clearance | 2mil | 1.5mil |
| Minimum soldermask DAM | 4mil 6mil |
3.5mil(For Green solder mask) 5mil(other than green) |
| Minimum coverage | 2mil | 1.5mil |
| Laser dia | 6mil | 5mil |
| Minimum annular ring | 6mil | 4mil |
| Outline dimensional Tolerance |
a)upto 299mm+/-0.1mm b)300-600mm+/-0.2mm c)>600mm+/-0.3mm |
- - - |
| PTH to PTH gap | 0.3mm | 0.254mm |
| NPTH to NPTH gap | 0.25mm | 0.2mm |
| PTH to NPTH gap | 0.3mm | 0.254mm |
| Hole edge to Board edge For routed Boards | 0.3mm | 0.25mm |
| Hole Edge to board Edge for Scoring Boards | 0.6mm | 0.5mm |
| Trace width and spacing tolerance | +/-20% | +/-10%(for control impedance) |
| PTH and NPTH slots length/width | +/- 0.1 mm | - |
| Web width | +/- 0.1 mm | - |
| V-cut depth | +/- 0.1 mm | - |
| PTH drill tolerance | +/0.076mm(3mil) upto 5.95mm +/-0.10mm(4mil) for 6mm and above |
+/-0.05mm(2mil) for pressfit holes |
| NPTH drill tolerance | +/0.076mm(3mil) upto 5.95mm +/-0.10mm(4mil) for 6mm and above |
+/-0.05mm(2mil) |
| PCB thickness tolerance | +/-0.15mm for PCB thickness <=1.5mm, +/-10% for >1.5mm (Typical tolerance) .Tolerance will depends on design and stack up. |
|
| Flex minimum thickness | 0.05mm | 0.025mm based on special request |
| Drill to copper | 7mil (Up to 6layers) | 10mils >10layers |
MINIMUM REQUIREMENT FOR THE COPPER FEATURES
| Layer | Finish copper thickness | Minimum trace width in mil | Minimum spacing in mil | Minimum drill to copper in mil | Minimum annular ring in mil |
|---|---|---|---|---|---|
| Inner layer | 18µm/ 0.5oz | 3.5 | 3.5 | 7 (up to 6Layers) | 5mil for vias, 7.5mil for component holese |
| 35µm / 1oz | 4 | 4 | 7 (up to 6Layers) | 5mil for vias, 8mil for component holes | |
| 70µm/ 2oz | 6 | 6 | 8mil(up to 6mil), 10mil >6layers | 7mil for vias, 9mil for component holes | |
| 105µm/ 3oz | 8 | 8 | 10mil(up to 6mil), 12mil >6layers | 9mil for vias, 11mil for component holes | |
| Outer layer | 9µm / 0.25oz | 3.5 | 3.5 | 5mil for vias, 7mil for component holes | Finish copper 35 µm |
| 18µm / 0.5oz | 4 | 4 | 5mil for vias, 7mil for component holes | Finish copper 43 µm | |
| 35µm / 1oz | 5 | 5 | 5mil for vias, 8mil for component holes | Finish copper 70 µm | |
| 70µm/ 2oz | 7 | 7 | 7mil for vias, 9mil for component holes Finish copper | 105 µmM | |
| 105µm/ 3oz | 9 | 9.5 | 9mil for vias, 11mil for component holes | Finish copper 140 µmM |